TA1中厚板电子束焊接组织性能及接头强化原因分析

白威; 李大东; 董雪娇; 陈容

doi:10.7513/j.issn.1004-7638.2021.06.025

TA1中厚板电子束焊接组织性能及接头强化原因分析

doi: 10.7513/j.issn.1004-7638.2021.06.025

攀钢集团研究院有限公司, 钒钛资源综合利用国家重点实验室, 四川攀枝花 617000

详细信息

作者简介:
白威（1989 —），男，研究生，主要研究方向：金属材料焊接，E-mail：pzhpyybw@163.com

中图分类号: TF823, TG456.3
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- 文章访问数: 405
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- 被引次数: 0
出版历程
- 收稿日期: 2021-07-06
- 刊出日期: 2021-12-31

Microstructure and properties of electron beam welded TA1 medium plate and analysis of joint strengthening

Pangang Group Research Institute Co., Ltd., State Key Laboratory of Vanadium and Titanium Resources Comprehensive Utilization, Panzhihua 617000, Sichuan, China

摘要

摘要: 采用真空电子束焊对30 mm厚TA1工业纯钛试板开展焊接试验，结合光学金相显微镜（OM）、维氏硬度、拉伸试验及电子背散射衍射（EBSD）对接头进行宏微观组织性能检验，分析电子束焊接过程对TA1材料微观组织与力学性能的影响及接头强化原因。结果表明：电子束焊接热循环过程使TA1母材至焊缝组织由等轴α向锯齿α转变；焊缝及热影响区的强度、硬度均高于母材；接头性能得到强化与锯齿α及针状α马氏体对硬度的提升作用、焊缝及热影响区内细小的锯齿状α晶粒以及微细孪晶对焊接组织的细化作用有关。
- TA1中厚板 /
- 电子束焊接 /
- 微观组织 /
- 力学性能
Abstract: Electron beam welding was used to weld 30 mm thick TA1 pure titanium plates. Combined with optical microscope (OM) and electron backscatter diffraction (EBSD), the microstructure, Vickers hardness and tensile test of the joint were carried out. The influence of welding process on microstructure and mechanical properties of TA1 material and the strengthening reason of the joint were analyzed. The results show that the microstructure from TA1 base metal to weld metal changes from equiaxed α to serrated α. The strength and hardness of welding seam and the heat affected zone are higher than the base metal. The strengthening of the joint properties is related to the increasing effect of serrated α and acicular α martensite on the hardness, the existence of a large number of serrated α lower than the grain size of the base metal in the weld seam and heat-affected zone, and the refining effect of micro-twinning on the welding microstructure.
- TA1 /
- electron beam welding /
- microstructures /
- mechanical properties

HTML全文

图 1 焊接装配示意 (单位：mm)

Figure 1. Assembly diagram of the welded joint

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图 2 接头截面宏观组织

（a）接头截面；（b）接头中层区域组织

Figure 2. Macro morphology of the welded joint

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图 3 TA1母材微观组织

Figure 3. Microstructures in base metal of TA1

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图 4 接头中层不同区域的微观组织

（a）接头组织形貌；（b）热影响区组织；（c）焊缝低倍组织；（d）焊缝高倍组织

Figure 4. Microstructures in different areas of the joint

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图 5 接头不同区域的截面组织形态（IPF图）

（a）上层；（b）中层；（c）下层

Figure 5. IPF images of the joint at different position

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图 6 焊缝（左）及热影响区（右）EBSD图

(a)(c)反极图；(b)(d)晶界取向分布；(e)(g)极图；(f)(h)孪晶取向差角/轴

Figure 6. EBSD images of weld seam and HAZ

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图 7 TA1焊接拉伸断裂试样

Figure 7. Tensile sample of the TA1 joint (after fracture)

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图 8 接头截面横向硬度分布

Figure 8. Hardness distribution of the welded joint

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表 1 TA1 化学成分

Table 1. Chemical composition of TA1 plate %

Fe	C	N	H	O	Ti
0.035	0.011	0.002	0.001	0.038	余量

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表 2 电子束焊接工艺参数

Table 2. Process parameters of EBW

工艺参数	加速电压 /kV	聚焦电流 /mA	束流 /mA	焊接速度/(mm·s⁻¹)	扫描频率 /Hz	扫描幅值 /mm	聚焦方式
定位焊	150	2250	30	15	8 000	0.5	下聚焦
深熔焊	150	2250	90	15	8 000	0.5	下聚焦

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表 3 TA1母材及接头室温（25 ℃）拉伸性能

Table 3. Tensile properties of BM and welded joints at room temperature

样品分类	取样位置	R_p0.2 /MPa	R_m /MPa	A /%	Z /%	断口距焊缝 /mm	焊缝直径 /mm	断口直径/mm
母材	上层	200.3	334.0	43.7	74.3
	中层	188.0	326.5	50.3	75.5
	下层	191.7	331.3	48.0	74.3
接头	上层	225.7	335.3	47.7	76.0	12.4	4.6	4.2
	中层	220.7	332.7	46.7	76.7	11.1	4.6	4.2
	下层	216.0	335.3	45.7	76.0	9.7	4.6	4.3
注：R_p0.2-屈服强度；R_m-抗拉强度；A-断后伸长率；Z-断面收缩率。

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